FLEXIBLE PACKAGING FOR CHIP-ON-CHIP AND PACKAGE-ON-PACKAGE TECHNOLOGIES

摘要

In one embodiment, the application integrated circuit (IC) and provides a packaging solution for one or more other IC The. Packaging solution (flip to the package substrate, the chip connection), and the application IC (in flip-chip orientation, not) of the other chip IC - on-chip packaging, and application of the IC and the other IC package-on-package packaging both to be able to support. Other IC package substrate deulroui chip-on-may include a first set of pads proximate to the application IC to support chip connection. The pad may be connected to the conductors that connect to the application IC to extend under the application IC. A second set of pads package-on-package can be connected to the pins for the package solution. Chip-on-chip solutions are proven to be the case can trust, the package-on-support can be removed for a package solution, the package substrate can be reduced in size ;