WEDGE TOOL FOR WIRE BONDING, BONDING DEVICE, WIRE BONDING METHOD, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a wedge tool for wire bonding with which one-side formation due to the wedge tool is suppressed in a bonded area and pressing force by ultrasonic oscillation does not concentrate on a toe side.SOLUTION: A wire holding part for holding a bonding wire 1 with a groove 20 is provided at a tip of a tool body 11. The aluminum bonding wire 1 is drawn out at the wire holding part, and ultrasonic oscillation is applied between the wire and an electrode 7 of a semiconductor chip 3 to form an adhesion core layer 8, thereby bonding the bonding wire 1. When the wedge tool 10 is pressed against the electrode 7 with the bonding wire 1 protruded from the groove 20, the bonded part is plastically deformed to become elliptical. The tip of the tool body 11 is tilted by a tilt angle from a heel H side toward a toe T side in a longitudinal direction of the bonding wire 1, so that the toe side of the bonding wire 1 is positioned closer to a bonding surface of the electrode 7 than the heel side and pressed.