首页> 外国专利> NITRIDE SEMICONDUCTOR EPITAXIAL WAFER FOR FIELD EFFECT TRANSISTOR, NITRIDE SEMICONDUCTOR-BASED FIELD EFFECT TRANSISTOR, AND METHOD OF MANUFACTURING NITRIDE SEMICONDUCTOR EPITAXIAL WAFER FOR FIELD EFFECT TRANSISTOR

NITRIDE SEMICONDUCTOR EPITAXIAL WAFER FOR FIELD EFFECT TRANSISTOR, NITRIDE SEMICONDUCTOR-BASED FIELD EFFECT TRANSISTOR, AND METHOD OF MANUFACTURING NITRIDE SEMICONDUCTOR EPITAXIAL WAFER FOR FIELD EFFECT TRANSISTOR

机译:用于场效应晶体管的氮化物半导体外延片,基于氮化物半导体的场效应晶体管以及制造用于场效应晶体管的氮化物半导体外延片的方法

摘要

PROBLEM TO BE SOLVED: To provide a method of manufacturing a nitride semiconductor epitaxial wafer that can relieve a trapping phenomenon of electrons and can suppress generation of a hexagonal defect.;SOLUTION: In the method of manufacturing a nitride semiconductor epitaxial wafer 10 including forming a kernel generation layer 2 on a substrate 1, forming a first nitride semiconductor layer 3 on the kernel generation layer 2, and forming a second nitride semiconductor layer 4 having smaller electron affinity than the first nitride semiconductor layer 3 on the first nitride semiconductor layer 3, growth temperature when the first nitride semiconductor layer 3 is formed is made lower than that when the second nitride semiconductor layer 4 is formed.;COPYRIGHT: (C)2013,JPO&INPIT
机译:解决的问题:提供一种制造氮化物半导体外延晶片的方法,该方法可以缓解电子的俘获现象并可以抑制六边形缺陷的产生。解决方案:在制造氮化物半导体外延晶片10的方法中,包括形成在基板1上形成核生成层2,在核生成层2上形成第一氮化物半导体层3,并且在第一氮化物半导体层3上形成具有比第一氮化物半导体层3小的电子亲和性的第二氮化物半导体层4,使形成第一氮化物半导体层3时的生长温度低于形成第二氮化物半导体层4时的生长温度。版权所有:(C)2013,JPO&INPIT

著录项

  • 公开/公告号JP2012235131A

    专利类型

  • 公开/公告日2012-11-29

    原文格式PDF

  • 申请/专利权人 HITACHI CABLE LTD;

    申请/专利号JP20120135361

  • 发明设计人 TANAKA TAKESHI;MATSUDA MICHIKO;

    申请日2012-06-15

  • 分类号H01L21/205;C23C16/34;H01L21/338;H01L29/778;H01L29/812;H01L21/20;

  • 国家 JP

  • 入库时间 2022-08-21 16:59:37

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