The wafer drier and the wafer dry manner which uses this

摘要

The object of the present invention is to provide a wafer drying device which can reduction damage to wafers and can reduction the amount of gas used and to provide a wafer drying method employing the same. The present invention relates to a wafer drying device and to a wafer drying method employing the same and wherein the device comprises: a chamber which has a first rotational shaft secured to one surface, has a movable second rotational shaft formed in an upper part and has a first water discharge port formed in a lower part; a tilt arm which is secured to the first rotational shaft and the second rotational shaft and ON the end of which is secured a cassette for mounting wafers; a first nozzle for supplying IPA/nitrogen gas to the cassette; a screw whereby the second rotational shaft is moved in a first direction or a second direction; and a drive motor for rotating the screw.