首页> 外文期刊>Research Disclosure >Fast Wafer Edge Gripper with optional Top Loader for handling warped wafers and Faster Wafer Exchange by a top side Wafer Handler with bottom clamping
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Fast Wafer Edge Gripper with optional Top Loader for handling warped wafers and Faster Wafer Exchange by a top side Wafer Handler with bottom clamping

机译:快速晶圆边缘夹爪,带有可选的顶部装载器,用于处理翘曲的晶圆;通过顶部晶圆处理器(底部夹持),可以更快地更换晶圆

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摘要

A lithographic apparatus is a machine that applies a desired pattern onto a substrate, usually onto a portion of the substrate. A lithographic apparatus can be used, for example, in the manufacture of integrated circuits (ICs). In lithographic processes, it is desirable frequently to make measurements of the structures created, e.g., for process control and verification. Such lithographic processes may require frequent wafer exchange, for example, moving an exposed wafer from a lithographic apparatus to a metrology or inspection apparatus. Driven by the growing demand of manufacturing modern integrated circuits with ever shrinking sizes, lithographic technologies that can offer higher resolution, belter reliability and higher throughput are under a fast-paced and extensive development. One of such advancing lithographic technologies is the extreme ultra-violet lithography (also known as EUV or EUVL), which allows for sub-10 nanometre (nm) scale resolution. Inevitably, the development of these cutting edge technologies will need to overcome numerous technical challenges. One of the technical challenges is to improve the speed and/or position accuracy for wafer exchange.
机译:光刻设备是将所需图案施加到衬底上,通常施加到衬底的一部分上的机器。光刻设备可以用于例如集成电路(IC)的制造中。在光刻工艺中,经常需要对所形成的结构进行测量,例如,以进行工艺控制和验证。这样的光刻工艺可能需要频繁的晶片更换,例如,将曝光的晶片从光刻设备移动到计量或检查设备。在制造尺寸不断缩小的现代集成电路的需求日益增长的推动下,可以提供更高的分辨率,更可靠的传送带和更高的吞吐量的光刻技术正在快速而广泛地发展。这种先进的光刻技术之一是极紫外光刻技术(也称为EUV或EUVL),可实现小于10纳米(nm)的分辨率。这些尖端技术的发展不可避免地需要克服众多技术挑战。技术挑战之一是提高晶片交换的速度和/或位置精度。

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    《Research Disclosure》 |2019年第664期|847-851|共5页
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  • 入库时间 2022-08-18 04:30:22

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