首页> 外文期刊>Research Disclosure >Fast Wafer Edge Gripper with optional Top Loader for handling warped wafers and Faster Wafer Exchange by a top side Wafer Handler with bottom clamping
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Fast Wafer Edge Gripper with optional Top Loader for handling warped wafers and Faster Wafer Exchange by a top side Wafer Handler with bottom clamping

机译:具有可选顶部装载机的快速晶圆边缘夹具,用于处理翘曲的晶片,并通过底部夹紧的顶侧晶片处理程序更快地晶圆交换

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摘要

A lithographic apparatus is a machine that applies a desired pattern onto a substrate, usually onto a portion of the substrate. A lithographic apparatus can be used, for example, in the manufacture of integrated circuits (ICs). In lithographic processes, it is desirable frequently to make measurements of the structures created, e.g., for process control and verification. Such lithographic processes may require frequent wafer exchange, for example, moving an exposed wafer from a lithographic apparatus to a metrology or inspection apparatus. Driven by the growing demand of manufacturing modern integrated circuits with ever shrinking sizes, lithographic technologies that can offer higher resolution, belter reliability and higher throughput are under a fast-paced and extensive development. One of such advancing lithographic technologies is the extreme ultra-violet lithography (also known as EUV or EUVL), which allows for sub-10 nanometre (nm) scale resolution. Inevitably, the development of these cutting edge technologies will need to overcome numerous technical challenges. One of the technical challenges is to improve the speed and/or position accuracy for wafer exchange.
机译:光刻设备是一种机器,该机器将所需图案施加到基板上,通常在基板的一部分上。例如,可以在集成电路(IC)的制造中使用光刻设备。在光刻过程中,频繁地理想地进行测量,例如用于过程控制和验证。这种光刻过程可能需要频繁的晶片交换,例如,将暴露的晶片从光刻设备移动到计量或检查装置。由于制造现代集成电路的需求不断增长,可以提供更高分辨率,吹送者可靠性和更高吞吐量的平移技术在快节奏和广泛的发展中。这种推进的平版技术之一是极端的紫外光刻(也称为EUV或EUV1),其允许亚10纳米(NM)刻度分辨率。不可避免地,这些尖端技术的发展需要克服许多技术挑战。其中一个技术挑战是提高晶片交换的速度和/或位置准确性。

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    《Research Disclosure》 |2019年第664期|847-851|共5页
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  • 入库时间 2022-08-18 21:57:59

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