To consist of the production manner of the ceramic substrate of the ceramic substrate of the substrate for power module and the substrate for power module and the production manner null of the substrate

摘要

PROBLEM TO BE SOLVED: To provide a ceramic substrate with which sufficient bonding strength can be obtained when the ceramic substrate containing Si is bonded with a metal member and whose bonding reliability at the time of thermal cycling is improved, and to provide a method for producing the ceramic substrate and a method for producing a substrate for a power module.;SOLUTION: In the ceramic substrate containing Si, the concentration of silicon oxide and silicon complex oxides in the surface of the substrate is set to 2.7 Atom% or below by surface measurement using an electron probe microanalyzer.;COPYRIGHT: (C)2010,JPO&INPIT