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Measurement of Heat Dissipation and Thermal-Stability of Power Modules on DBC Substrates with Various Ceramics by SiC Micro-Heater Chip System and Ag Sinter Joining

机译：通过SIC微加热器芯片系统和AG烧结陶瓷用各种陶瓷对DBC基板上电力模块的散热和热稳定性的测量

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Dongjin Kim; Yasuyuki Yamamoto; Shijo Nagao; Naoki Wakasugi; Chuantong Chen; Katsuaki Suganuma;
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1. Online Thermal Resistance and Reliability Characteristic Monitoring of Power Modules With Ag Sinter Joining and Pb, Pb-Free Solders During Power Cycling Test by SiC TEG Chip [J] . Kim Dongjin, Nagao Shijo, Chen Chuantong, IEEE Transactions on Power Electronics . 2021,第5期

机译：通过SiC TEG芯片在动力循环试验期间用AG烧结加入和Pb，无铅焊接电力电阻和可靠性特性监测电力模块
2. Strengthening of DBA substrate with Ni/Ti/Ag metallization for thermal fatigue-resistant Ag sinter joining in GaN power modules [J] . Dongjin Kim, Chuantong Chen, Seung-Joon Lee, Journal of materials science . 2020,第4期

机译：用Ni / Ti / Ag金属化加强在GaN电源模块中加入热疲劳抗性Ag烧结的DBA衬底
3. A Novel DBC Layout for Current Imbalance Mitigation in SiC MOSFET Multichip Power Modules [J] . Helong Li, Stig Munk-Nielsen, Szymon Bęczkowski, IEEE Transactions on Power Electronics . 2016,第12期

机译：用于缓解SiC MOSFET多芯片功率模块中电流不平衡的新颖DBC布局
4. GaN micro-heater chip for power cycling of die attach modules with Ag sinter joint and high temperature solder [C] . Dongjin Kim, Shijo Nagao, Chuantong Chen, International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management . 2019

机译：GaN微加热器芯片，用于通过Ag烧结接头和高温焊料对芯片连接模块进行功率循环
5. Models for yield estimation of multichip module ceramic substrates [D] . Castano, Rebecca L. 1998

机译：多芯片模块陶瓷基板的产量估算模型
6. Measurement of Heat Dissipation and Thermal-Stability of Power Modules on DBC Substrates with Various Ceramics by SiC Micro-Heater Chip System and Ag Sinter Joining [O] . Dongjin Kim, Yasuyuki Yamamoto, Shijo Nagao, 2019

机译：SiC微型加热器芯片系统和Ag烧结连接法测量各种陶瓷DBC基板上功率模块的散热和热稳定性
7. Heat Dissipation and Thermo-mechanical Reliability Study for Multi-chip Module High Power LED Integrated Packaging with Through Silicon Vias [O] . Kailin Pan, Yu Guo, Guotao Ren, 2014

机译：多芯片模块高功率LED集成包装的散热和热机械可靠性研究与硅通孔集成

Measurement of Heat Dissipation and Thermal-Stability of Power Modules on DBC Substrates with Various Ceramics by SiC Micro-Heater Chip System and Ag Sinter Joining

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