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In production manner of the substrate for power module and the aspect of one side of the production mannered null ceramic substrate
In production manner of the substrate for power module and the aspect of one side of the production mannered null ceramic substrate
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机译:功率模块基板的生产方式及生产方式为空的陶瓷基板一侧的方面
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摘要
PROBLEM TO BE SOLVED: To provide a power module substrate which can easily and reliably join a semiconductor element to a circuit layer, a power module substrate having a heat sink, and a method of manufacturing a power muddle using the power module substrate.;SOLUTION: In a power module substrate 10, a circuit layer 12 formed of aluminum or an aluminum alloy is provided on one surface of a ceramic substrate 11, and a semiconductor element is provided on the circuit layer 12 with a solder material disposed therebetween. A metallic film 32 formed of a metal having favorable junction performance to the solder material and a protective film 33 which covers and protects the metallic film 32 are formed at one surface side of the circuit layer 12.;COPYRIGHT: (C)2011,JPO&INPIT
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