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ELECTRONIC MEMS DEVICE COMPRISING A CHIP BONDED TO A SUBSTRATE AND HAVING CAVITIES AND MANUFACTURING PROCESS THEREOF
ELECTRONIC MEMS DEVICE COMPRISING A CHIP BONDED TO A SUBSTRATE AND HAVING CAVITIES AND MANUFACTURING PROCESS THEREOF
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机译:包含与基板结合的芯片并具有空腔和制造工艺的电子MEMS器件
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摘要
An electronic MEMS device is formed by a chip having with a main face and bonded to a support via an adhesive layer. A cavity extends inside the chip from its main face and is closed by a flexible film covering the main face of the chip at least in the area of the cavity. The support has a depressed portion facing the cavity and delimited by a protruding portion facing the main face of the chip. Inside the depressed portion, the adhesive layer has a greater thickness than the projecting portion so as to be able to absorb any swelling of the flexible film as a result of the expansion of the gas contained inside the cavity during thermal processes.
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