首页> 外国专利> NICKEL-GOLD PLATEABLE THICK FILM SILVER PASTE, AND PLATING PROCESS FOR LOW TEMPERATURE CO FIRED CERAMIC DEVICES AND LTCC DEVICES MADE THEREFROM

NICKEL-GOLD PLATEABLE THICK FILM SILVER PASTE, AND PLATING PROCESS FOR LOW TEMPERATURE CO FIRED CERAMIC DEVICES AND LTCC DEVICES MADE THEREFROM

机译:镍金可镀厚膜银浆,以及由其制成的低温烧结陶瓷器件和LTCC器件的镀覆工艺

摘要

Described are LTCC devices, with external silver containing electrical contacts, that are sequentially plated with a nickel containing metal and a gold containing metal.
机译:描述了具有外部含银电触点的LTCC器件,该器件依次镀有含镍金属和含金金属。

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