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LED PACKAGE OF INDIRECT ILLUMINATION AND METHOD OF MANUFACTURING THEREOF, AND ILLUMINATOR USING THE SAME

机译:间接照明的LED封装及其制造方法,以及使用该封装的照明器

摘要

PURPOSE: An LED package of indirect illumination and a method for manufacturing thereof, and an illuminator are provided to prevent a glare phenomenon by securing indirect illumination in the LED package. CONSTITUTION: A first substrate(100) has a cavity. A second substrate(200) is arranged on the first substrate. The second substrate includes an opening part(201), a metal layer(210), and a light emitting device(220) formed in the metal layer of the opening part. The metal layer is formed in the inner surface of the opening part and the lower surface of the second substrate. A first electrode(110) and a second electrode(120) are electrically connected to the light emitting device. The first and the second electrode act as light reflectors for the light emitted from the light emitting device.
机译:目的:提供一种间接照明的LED封装及其制造方法,以及一种照明器,以通过将间接照明确保在LED封装中来防止眩光现象。组成:第一基板(100)有一个空腔。第二基板(200)布置在第一基板上。第二基板包括开口部分(201),金属层(210)和形成在开口部分的金属层中的发光器件(220)。金属层形成在开口部的内表面和第二基板的下表面中。第一电极(110)和第二电极(120)电连接至发光器件。第一电极和第二电极用作从发光器件发射的光的光反射器。

著录项

  • 公开/公告号KR20130039808A

    专利类型

  • 公开/公告日2013-04-23

    原文格式PDF

  • 申请/专利权人 LG INNOTEK CO. LTD.;

    申请/专利号KR20110104388

  • 发明设计人 KIM JUN HYOUNG;

    申请日2011-10-13

  • 分类号H01L33/48;

  • 国家 KR

  • 入库时间 2022-08-21 16:27:21

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