LED Package of Indirect Illumination and Method of Manufacturing Thereof and Illuminator Using the same

摘要

An embodiment of the present invention relates to an indirect lighting type LED package and a lighting apparatus using the same. In that embodiment, indirect lighting is implemented directly at the LED package end, thereby improving color uniformity and reducing glare. Further, since the illumination device does not require a reflective layer, the size of the illumination device can be drastically reduced. An LED package according to an embodiment includes a first substrate including a cavity and an electrode disposed inside the cavity and a second substrate disposed on the first substrate, And a light emitting element formed on an inner surface of the opening and a metal layer formed on a lower surface of the second substrate and a metal layer of the opening and arranged to face the electrode, Is disposed above the edge of the cavity to cover a part of the cavity.