首页> 外国专利> INDIRECT ILLUMINATION LED PACKAGE, A METHOD FOR MANUFACTURING THE SAME, AND AN ILLUMINATOR USING THE SAME CAPABLE OF REDUCING THE SIZE OF A LAMP

INDIRECT ILLUMINATION LED PACKAGE, A METHOD FOR MANUFACTURING THE SAME, AND AN ILLUMINATOR USING THE SAME CAPABLE OF REDUCING THE SIZE OF A LAMP

机译:间接照明LED封装,一种相同制造方法以及一种使用能够减小灯管尺寸的照明器

摘要

PURPOSE: An indirect illumination LED package, a method for manufacturing the same, and an illuminator using the same are provided to improve color uniformity and to prevent glaringness by securing indirect illumination in an LED package.;CONSTITUTION: A first substrate(100) has a cavity. A first electrode(110) and a second electrode(120) are arranged on the first substrate. A second substrate(200) is arranged on the first substrate. A light emitting device faces the first and second electrodes. A metal layer electrically connects the light emitting device to the first electrode and the second electrode on the second substrate.;COPYRIGHT KIPO 2013
机译:目的:提供一种间接照明LED封装,其制造方法和使用该照明器的照明器,以通过确保在LED封装中的间接照明来改善颜色均匀性并防止眩光。组成:第一基板(100)具有空腔。第一电极(110)和第二电极(120)布置在第一基板上。第二基板(200)布置在第一基板上。发光器件面对第一电极和第二电极。金属层将发光器件电连接到第二基板上的第一电极和第二电极。; COPYRIGHT KIPO 2013

著录项

  • 公开/公告号KR20130039094A

    专利类型

  • 公开/公告日2013-04-19

    原文格式PDF

  • 申请/专利权人 LG INNOTEK CO. LTD.;

    申请/专利号KR20110103554

  • 发明设计人 KIM JUN HYOUNG;

    申请日2011-10-11

  • 分类号H01L33/48;H01L33/62;

  • 国家 KR

  • 入库时间 2022-08-21 16:27:21

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