首页> 外国专利> LED PACKAGE OF INDIRECT ILLUMINATION AND A METHOD FOR MANUFACTURING THE SAME, AND AN ILLUMINATOR USING THE SAME CAPABLE OF PREVENTING A GLARE PHENOMENON

LED PACKAGE OF INDIRECT ILLUMINATION AND A METHOD FOR MANUFACTURING THE SAME, AND AN ILLUMINATOR USING THE SAME CAPABLE OF PREVENTING A GLARE PHENOMENON

机译:间接照明的LED封装及其制造方法,以及具有相同能力的防止眩光现象的照明器

摘要

PURPOSE: An LED package of indirect illumination and a method for manufacturing the same, and an illuminator using the same are provided to secure indirect illumination in the LED package and to improve color uniformity.;CONSTITUTION: A first substrate(100) has a cavity. A second substrate(200) is arranged in the upper center of the cavity. A first electrode(110) and a second electrode(120) are formed on the first substrate. The first electrode is electrically separated from the second electrode. A light emitting device(220) faces the first and the second electrode. A metal layer(210) electrically connects the light emitting device to the electrodes.;COPYRIGHT KIPO 2013
机译:目的:提供一种间接照明的LED封装及其制造方法,以及使用该封装的照明器,以确保间接照明在LED封装中并改善色彩均匀性。;组成:第一基板(100)具有空腔。第二基板(200)布置在腔的上部中心。在第一基板上形成第一电极(110)和第二电极(120)。第一电极与第二电极电隔离。发光器件(220)面对第一和第二电极。金属层(210)将发光器件电连接到电极。; COPYRIGHT KIPO 2013

著录项

  • 公开/公告号KR20130039982A

    专利类型

  • 公开/公告日2013-04-23

    原文格式PDF

  • 申请/专利权人 LG INNOTEK CO. LTD.;

    申请/专利号KR20110104694

  • 发明设计人 KIM JUN HYOUNG;

    申请日2011-10-13

  • 分类号H01L33/48;H01L33/62;

  • 国家 KR

  • 入库时间 2022-08-21 16:27:18

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