METHOD FOR MANUFACTURING A MOLDING PACKAGE WITHOUT AN INTERPOSER CAPABLE OF REDUCING THE SIZE OF A PRODUCT

摘要

PURPOSE: A method for manufacturing a molding package without an interposer is provided to electrically connect an IC chip to a main board by performing a molding process after the terminal of the IC chip is bonded to a metal plate.;CONSTITUTION: A connection terminal is electrically connected to an IC chip (S30). The peripheral part of the IC chip is molded (S40). A carrier used as a temporary supporter is removed (S50). A through hole is formed on the upper part of a structure after a metal plate is laminated. An upper metal plate is connected to a lower metal plate by plating the through hole (S60).;COPYRIGHT KIPO 2013;[Reference numerals] (AA) Start; (BB) End; (S10) Metal plate is combined with a carrier; (S20) Connection terminal is formed on a metal plate by a solder mask process; (S30) Connection terminal is electrically connected to an IC chip; (S40) Peripheral part of the IC chip is molded; (S50) Carrier used as a temporary supporter is removed; (S60) Through hole is formed on the upper part of a structure after a metal plate is laminated. An upper metal plate is connected to a lower metal plate by plating the through hole; (S70) Upper and lower metal plates are electrically connected