ELECTROLESS COPPER PLATING METHOD AND A NODULE PREVENTING DEVICE FOR PREVENTING THE GENERATION OF NODULES

摘要

PURPOSE: An electroless copper plating method and a nodule preventing device are provided to prevent the quality degradation of a printed circuit board by preventing the generation of nodules in adhesives or bonding sheets.;CONSTITUTION: An electroless copper plating method for preventing the generation of nodules is as follows: a cleaning step(S10) of cleaning a board having a through-hole or a via hole; a nodule preventing step(S100) of preventing the generation of nodules; a soft etching step(S20); a pre dip step(S30); a catalyst processing step(S40); a reducing step(S50); and a chemical step(S60). In the nodule preventing step, high-temperature dried air heated by a heater is blown toward the board to harden adhesives or bonding sheets and to vibrate the board.;COPYRIGHT KIPO 2013;[Reference numerals] (S10) Cleaning; (S100) Module preventing; (S11,S21,S41,S51,S61) Washing; (S20) Soft etching; (S30) Pre dipping; (S40) Catalyst processing; (S50) Reducing; (S60) Chemical copper plating