ELECTROLESS PLATING APPARATUS AND AN ELECTROLESS PLATING METHOD CAPABLE OF PREVENTING THE DISPERSION OF A PLATING SOLUTION

摘要

PURPOSE: An electroless plating apparatus and an electroless plating method are provided to uniformity form a plating layer by continuously flow a plating solution along the surface of a substrate.;CONSTITUTION: A plating pretreatment bath has a plating pretreatment circulation line. The plating pretreatment circulation line has a temperature control function for a plating pretreatment solution. A plating bath has a plating solution circulation line. The plating solution circulation line has a filter and a temperature control function of a plating solution. The plating solution circulation line is connected to a flushing line(114).;COPYRIGHT KIPO 2013