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Electroless copper plating on graphite/epoxy and graphite/cyanate ester laminates.

机译:在石墨/环氧树脂和石墨/氰酸酯层压板上进行化学镀铜。

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摘要

This thesis addresses the effects of surface preparation conditions on electroless copper plating of graphite/epoxy and graphite/cyanate ester liminates. An alkaline permanganate etchant was applied to the substrates by three methods: immersion, ultrasonic immersion and spray etching. Three etching parameters were investigated: permanganate concentration, etching temperature and etching time. A High Power Microscope was used to characterize the surface topography of the etched and plated laminates.; Results showed that permanganate concentration and etching time were two major factors in etching. Immersion, ultrasonic immersion and spray etching methods resulted in different surface topography. Some of the laminates plated in the electroless copper deposition bath for 1 minute could pass tape test. While at copper deposition time of 15 minutes, the adhesion of tape test classification 3 was achieved on untoughened graphite/cyanate ester laminates. Poor plating could be explained by insufficient surface roughness.
机译:本文研究了表面制备条件对石墨/环氧树脂和石墨/氰酸酯类酯化物化学镀铜的影响。通过三种方法将碱性高锰酸盐蚀刻剂施加到基板上:浸入,超声浸入和喷涂蚀刻。研究了三个蚀刻参数:高锰酸盐浓度,蚀刻温度和蚀刻时间。使用高倍显微镜表征蚀刻和镀覆的层压板的表面形貌。结果表明,高锰酸盐浓度和腐蚀时间是腐蚀的两个主要因素。浸入,超声浸没和喷雾蚀刻方法导致不同的表面形貌。在无电铜沉积浴中电镀1分钟的某些层压板可以通过胶带测试。当铜沉积时间为15分钟时,在未增韧的石墨/氰酸酯层压材料上达到了胶带测试分类3的粘合力。镀层不良的原因是表面粗糙度不足。

著录项

  • 作者

    Xu, Hong.;

  • 作者单位

    San Jose State University.;

  • 授予单位 San Jose State University.;
  • 学科 Engineering Chemical.
  • 学位 M.S.
  • 年度 1998
  • 页码 92 p.
  • 总页数 92
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 化工过程(物理过程及物理化学过程);
  • 关键词

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