Semiconductor device module with flip-chip devices on a common lead frame

摘要

At least one semiconductor portion of a circuit disposed in a common housing, the semiconductor portion of the circuit comprising: 1.1 a plurality of flip-chip power semiconductor switches (15, 25) connected together without wire bonding by a connector portion (80) and without wire bonding to respective contact areas a carrier body (20) are connected, each power semiconductor switch having a respective conductor tracks (52) connected control electrode (32, 45); 1.2 a control IC (94) for controlling the flip-chip power semiconductor switches (15, 25) which is flip-chip mounted on the carrier body (20) and is operatively connected to the control electrodes (32, 45) connected to the conductor tracks (52) ; and 1.3 a land portion (82) connected to the connection portion (80) and to another contact area (84) of the support body (20) so that the power semiconductor switches are connected to each other and to the other contact area without wire bonding.