SUBSTRATE WARPAGE CORRECTION DEVICE, SUBSTRATE WARPAGE CORRECTION METHOD, MARKING APPARATUS AND MARKING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a substrate warpage correction device, a substrate warpage correction method using the same, a marking apparatus comprising the substrate warpage correction device, and a marking method using the same.;SOLUTION: The substrate warpage correction device comprises a holding table for holding a substrate, heating means for heating the substrate, and cooling means for cooling the substrate. The substrate warpage correction method is adapted to correct warpage of the substrate when applying predetermined processing to the substrate while using the substrate warpage correction device. The substrate warpage correction method includes: a heating step of heating the substrate held by the holding table through the heating means before a step of applying the predetermined processing; and a step of cooling the substrate through the cooling means after the heating step.;COPYRIGHT: (C)2015,JPO&INPIT