首页> 外文期刊>IEEE transactions on device and materials reliability >Corrections to “Material Characterization and Warpage Modeling for Power Devices Active Metal Brazed Substrates” [Sep 19 537-542]
【24h】

Corrections to “Material Characterization and Warpage Modeling for Power Devices Active Metal Brazed Substrates” [Sep 19 537-542]

机译:“电力设备有源金属钎焊基板的材料表征和翘曲建模”的校正[9月19日537-542]

获取原文
获取原文并翻译 | 示例
           

摘要

In [1] below, reference 1 is incorrect. It should read: A. Sitta, M. Calabretta, M. Renna, and D. Cavallaro, "Solder joint reliability: Thermo-mechanical analysis on power flat packages" in Advances on Mechanics, Design Engineering and Manufacturing. Cham, Switzerland: Springer, 2017, pp. 709-716.
机译:在下面的[1]中,参考1不正确。它应该阅读:A.Sitta,M. Calabretta,M.Renna和D. Cavallaro,“焊接联合可靠性:电力平包热机械分析”在机械,设计工程和制造业的进步。 Cham,瑞士:Springer,2017,PP。709-716。

著录项

相似文献

  • 外文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号