And a method of manufacturing electronic materials for the Cu-Ni-Si-based copper alloy

摘要

PROBLEM TO BE SOLVED: To provide a Cu-Ni-Si based alloy having an improved spring deflection limit.;SOLUTION: The copper alloy for an electronic material contains 1.0-4.0 mass% Ni, 0.2-1.0 mass% Si and the balance comprising Cu and inevitable impurities. In a measurement result obtained by X-ray diffraction pole figure measurement on a rolling surface as a reference, among the diffraction peak intensities of a {111}Cu surface to a {200} Cu surface obtained by β scanning at α=35°, a peak height at β angle 90° is equal to or more than 2.5 times of that of standard copper powder.;COPYRIGHT: (C)2013,JPO&INPIT