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Interconnection tape providing a serial electrode pad connection in a semiconductor device
Interconnection tape providing a serial electrode pad connection in a semiconductor device
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机译:提供半导体器件中串行电极焊盘连接的互连带
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摘要
A semiconductor device has a semiconductor chip and a first interconnection tape. The semiconductor chip has a plurality of first electrode pads arranged on a first surface. The first interconnection tape is in contact with each of the plurality of first electrode pads such that the plurality of first electrode pads are electrically connected with each other.
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