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Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems

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1.Development of a Self-Cooling System Utilizing Waste Heat from Electronic Equipment

机译：利用电子设备的废热开发自冷热系统
- 作者：Masaru Ishizuka;Shinji Nakagawa;Katsuhiro Koizumi
- 会议名称：《Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2006年
- Cooling of electronic equipment;
- Utilization of waste heat;
- Energy saving;
- Cooling fan;
- Turbine;
2.Impact of Thermal Constraints on Multi-Core Architectures

机译：热约束对多核架构的影响
- 作者：Yingmin Li;Benjamin Lee;David Brooks;Zhigang Hu;Kevin Skadron
- 会议名称：《Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2006年
- Multi-core architecture;
- Thermal management;
- Compact thermal models;
3.Thermal Design Optimization for Strip-Fin Heat Sinks with a Ducted Air Flow

机译：带状空气流动带状散热器的热设计优化
- 作者：H. T. Chen;P. L. Chen;J. T. Horng;S. F. Chang;T. Y. Wu;Y. H. Hung
- 会议名称：《Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2006年
- Strip-Fin Heat Sink;
- Optimal Design;
- DOE;
- CCD;
- RSM;
4.Numerical Simulation of Microscale Ionic Wind for Local Cooling Enhancement

机译：微观离子风对局部冷却增强的数值模拟
- 作者：David B. Go;Suresh V. Garimella;Timothy S. Fisher
- 会议名称：《Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2006年
- Microscale ionic wind;
- Electrohydrodynamics;
- Heat transfer;
- Enhancement;
5.MODELING OF THERMAL CONDUCTIVITY OF NANOFIBER-BASED NANOCOMPOSITE

机译：基于纳米纤维纳米复合材料的导热系数建模
- 作者：Ravi S. Prasher;Sanjiv Sinha
- 会议名称：《Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2006年
6.Computational Modeling of the Reliability of Stacked Low Density Interconnects Devices

机译：堆叠低密度互连设备可靠性的计算建模
- 作者：Mohammad M. Hossain;Yongje Lee;Roksana Akhter;Dereje Agonafer;Terry Dishongh
- 会议名称：《Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2006年
- 3D Stack package;
- Thermo-mechanical reliability;
- Flashes memory and Finite Element Modeling;
7.RELIABILITY OF FLIP CHIP ASSEMBLIES SUBJECTED TO EXTREME LOW TEMPERATURES

机译：倒装芯片组件的可靠性受到极低温度的
- 作者：M. Kaysar Rahim;Jeffrey C. Suhling;Richard C. Jaeger;Pradeep Lall;Roy Knight;Mark Strickland;Jim Blanche
- 会议名称：《Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2006年
- Space Electronics;
- Cryogenic;
- Flip Chip;
- Test Chip;
- Stress;
- Reliability;
8.PARAMETRIC INVESTIGATION OF LIQUID COOLING MODULE USING FC-72

机译：使用FC-72的液体冷却模块的参数研究
- 作者：J. S. Kim;W. H. Cha;K. N. Rainey;S. Lee;S. M. You
- 会议名称：《Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2006年
- Liquid Cooling Module;
- Boiling;
- Condensation;
- Parametric investigation;
9.An Optimal Approach with Genetic Algorithm for Thermal Performance of Heat Sink/TEC Assembly

机译：散热器/ TEC组装热性能遗传算法的最佳方法
- 作者：C. H. Peng;M. C. Wu;J. T. Horng;C. Y. Lee;C. J. Fang;Y. H. Hung
- 会议名称：《Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2006年
- Thermoelectric Cooler;
- TEC;
- Optimal Design;
- COP;
10.A FE-STUDY OF SOLDER FATIGUE COMPARED TO MICROSTRUCTURAL DAMAGE EVALUATION BY IN-SITU LASER SCANNING AND FIB MICROSCOPY

机译：与原位激光扫描和FIB显微镜的微观结构损伤评估相比，焊料疲劳的FE研究
- 作者：Rainer Dudek;Wolfgang Faust;Astrid Gollhard;Bernd Michel
- 会议名称：《Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2006年
11.Thermal Properties of Metal-Coated Vertically-Aligned Single Wall Nanotube Films

机译：金属涂层垂直排列的单壁纳米管膜的热性能
- 作者：M. Panzer;G. Zhang;D. Mann;X. Hu;E. Pop;H. Dai;K. E. Goodson
- 会议名称：《Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2006年
12.THERMAL AND ELECTRICAL CHARACTERIZATION OF NANOCOMPOSITES FOR THERMOELECTRICS

机译：热电测量纳米复合材料的热和电学特性
- 作者：Stephen R. Hostler;Pankaj Kaul;Kevin Day;Violet Qu;Chad Cullen;Alexis R. Abramson;Xiaofeng Qiu;Clemens Burda
- 会议名称：《Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2006年
- Bismuth;
- Polyaniline;
- Seebeck coefficient;
- Thermal conductivity;
- Electrical conductivity;
- Figure of merit;
13.PHONON RELAXATION RATES IN SILICON THIN FILMS DETERMINED BY MOLECULAR DYNAMICS

机译：分子动力学决定的硅薄膜中的声子放宽速率
- 作者：Javier V. Goicochea;Marcela Madrid;Cristina H. Amon
- 会议名称：《Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2006年
- Relaxation times;
- Relaxation rates;
- Normal modes;
- Thin films;
- Thermal conductivity;
- Silicon;
- Molecular dynamics;
14.Root Cause of Black Pad Failure of Solder Joints with Electroless Nickel/Immersion Gold Plating

机译：用无电镀镍/浸渍镀金的焊点黑色垫失效的根本原因
- 作者：Kejun Zeng;Roger Stierman;Don Abbott;Masood Murtuza
- 会议名称：《Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2006年
- Solder reaction;
- Reliability;
- Black pad;
- Electroless nickel;
- Immersion gold;
15.Impact of Enabling solution design on SLI reliability during Temperature Cycling using Shadow Moire

机译：浅色循环温度循环期间SLI可靠性启用解决方案设计的影响
- 作者：Karumbu Meyyappan;Phil Geng;Ife Hsu
- 会议名称：《Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2006年
- Board Level Shadow Moire;
- Warpage;
- Curvature;
- Socket;
- Enabling solution;
- Second level interconnect;
- Solder joint reliability;
16.A Statistical Analysis of Thermal Interface Materials Enhanced by Vertically Aligned Carbon Nanotubes

机译：垂直排列碳纳米管增强热界面材料的统计分析
- 作者：Anand Desai;James Geer;Bahgat Sammakia
- 会议名称：《Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2006年
- Thermal Management;
- Carbon Nanotubes;
- Thermal interface material (TIM);
- Numerical modeling;
- Random nanotube height;
17.An Experimental Study of Fluidic Coupling Between Multiple Piezoelectric Fans

机译：多压电风扇流体耦合的实验研究
- 作者：Mark Kimber;Suresh V. Garimella;Arvind Raman
- 会议名称：《Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2006年
- Piezoelectric fan;
- Fluidic coupling;
- Cantilever;
18.SPATIALLY-RESOLVED IMAGING OF MICROPROCESSOR POWER (SIMP): HOTSPOTS IN MICROPROCESSORS

机译：微处理器电源（SIMP）的空间分辨成像：微处理器中的热点
- 作者：Hendrik F. Hamann;James Lacey;Alan Weger;Jamil Wakil
- 会议名称：《Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2006年
- Microprocessor power;
- Thermal management;
- Package design;
- Hotspots;
- High power density chips;
19.A THERMAL CONDUCTIVITY MODEL FOR MICRO-NANOSCALE DIAMOND THIN FILMS USING DISPERSION CURVE DATA

机译：微纳米级金刚石薄膜使用色散曲线数据的热导电模型
- 作者：Todd Kalisik;Pradip Majumdar
- 会议名称：《Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2006年
- Micro-Nanoscale;
- Thermal Conductivity;
- Diamond;
20.PCB Thermal Via Optimization using Design of Experiments

机译：使用实验设计通过优化PCB热量
- 作者：Tony A. Asghari
- 会议名称：《Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2006年
- Design of Experiments;
- Factorial Design;
- MINITAB;
- Icepak CFD;
- PCB;
- Thermal Resistance;
- Thermal Via;
- Optimization;
21.SOLDER INTERCONNECTION SPECIMEN DESIGN AND TEST CONTROL PROCEDURE FOR VALID CONSTITUTIVE MODELING OF SOLDER ALLOYS

机译：焊料互连标本设计和试验控制程序，用于焊料合金的有效本构型建模
- 作者：D. Bhate;D. Chan;G. Subbarayan;T. C. Chiu
- 会议名称：《Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2006年
- Lead-free solder;
- Constitutive modeling;
- Interconnect level testing;
- Solder joint shape/geometry effects;
22.THERMAL DEVELOPMENT, MODELING AND CHARACTERIZATION OF THE CELL PROCESSOR MODULE

机译：电池处理器模块的热开发，建模和表征
- 作者：Jamil Wakil;David Questad;Michael Gaynes;Hendrik Hamann;Alan Weger;Michael Wang;Paul Harvey;Edward Yarmchuk;Jeffrey Coffin;Kazuaki Yazawa;Tetsuji Tamura;Iwao Takiguchi;Hideo Aoki
- 会议名称：《Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2006年
- Cell processor;
- Thermal;
- Package;
- Power;
- Interface resistance;
23.A Methodology for Thermal Evaluation of Strongly Bonded Packaging Materials

机译：热粘合包装材料热评价的方法
- 作者：Margaret Stern;Don Kearns;Vadim Gektin;Gawtam Jhoty
- 会议名称：《Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2006年
- Thermal interface materials;
- TIM;
- Guarded heat flow;
- Contact resistance;
- Voids;
- Electronic packaging;
24.Life Prediction and Damage Equivalency for Shock Survivability of Electronic Components

机译：电子元件休克存活性的寿命预测和损伤等效
- 作者：Pradeep Lall;Dhananjay Panchagade;Deepti Iyengar;Jeff Suhling
- 会议名称：《Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2006年
- Shock;
- Vibration;
- Drop-Impact;
- Ball-Grid Arrays;
- Life-Prediction;
- Reliability;
25.AN ELECTRONIC PACKAGING DESIGN FOR REDUCTION OF THERMAL INTERFACE RESISTANCE

机译：用于降低热界面电阻的电子包装设计
- 作者：Katey Lo;Wenjun Liu;Larry Pileggi;Mehdi Asheghi
- 会议名称：《Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2006年
26.THERMAL MODELING OF MULTI-CORE PROCESSORS

机译：多核处理器的热建模
- 作者：Guoping Xu
- 会议名称：《Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2006年
- Thermal model;
- Circuit design;
- Electronic package;
- Air-cooling;
27.EFFECT OF VARIATION IN HEAT FLUX AT LEADING PORTION ON A PCB SUBJECTED TO NATURAL CONVECTION COOLING IN AIR

机译：在空气中经受自然对流冷却的PCB领先部分在前导部分中的热量通量的影响
- 作者：Vipin Yadav;Keshav Kant
- 会议名称：《Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2006年
- Uniform Wall Temperature;
- Natural Convection;
- PCB;
28.SIMULTANEOUS ELECTRO-THERMAL TEST METHOD FOR PYROELECTRIC MICROSENSORS

机译：热电微传导料同时电热试火试验方法
- 作者：Brian Smith;Aaron Vanderbeek;Cristina Amon
- 会议名称：《Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2006年
- Film thermal conductivity;
- Pyroelectric coefficient;
- Measurement;
- Infrared sensor;
- IRFPA;
29.A STATISTICAL PREDICTION OF COLD AISLE END AIRFLOW BOUNDARY CONDITIONS

机译：冷通道端气流边界条件的统计预测
- 作者：Saurabh K. Shrivastava;James W. VanGilder;Bahgat G. Sammakia
- 会议名称：《Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2006年
- Data Center;
- Rack Cooling;
- Airflow Boundary Conditions;
- Regression modeling;
30.Multiscale Stress Analysis Using EDIP Silicon

机译：使用EDIP Silicon的多尺度应力分析
- 作者：Chunjian Ni;Jayathi Murthy
- 会议名称：《Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2006年
- Multiscale;
- Stress Analysis;
- EDIP;
- Finite Volume;
31.RELIABILITY ANALYSIS ON EPOXY BASED THERMAL INTERFACE SUBJECTED TO MOISTURE ENVIRONMENT

机译：水分环境对环氧基的热界面的可靠性分析
- 作者：Wei Zou;Jeffrey Coffin;Amilcar Arvelo
- 会议名称：《Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2006年
- Thermal interface;
- Epoxy;
- Temperature;
- Humidity;
- Reliability;
- Shear strength;
32.Pool boiling study on candidature of pentane, methanol and water for near room temperature cooling

机译：泳池沸腾研究戊烷，甲醇和近室温冷却料
- 作者：W. Bailey;E. Young;C. Beduz;Y. Yang
- 会议名称：《Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2006年
- Critical Heat Flux;
- Pool Boiling;
33.Tubing Selection for Sealed-for-Life Liquid Cooling Units for Electronics

机译：用于电子设备的密封液体冷却装置的管材选择
- 作者：Frank A. Valdez
- 会议名称：《Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2006年
- Tubing;
- Liquid cooling;
- WVTR;
- Permeation;
- Flammability;
- Polymer;
34.THERMAL CONDUCTIVITY OF AMORPHOUS SILICA USING NON-EQUILIBRIUM MOLECULAR DYNAMICS SIMULATIONS

机译：使用非平衡分子动力学模拟的无定形二氧化硅的导热系数
- 作者：S. Mahajan;G. Subbarayan;B. G. Sammakia
- 会议名称：《Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2006年
- Finite size;
- Silica;
- Thermal conductivity;
- Molecular dynamics simulation;
35.OPTIMIZATION OF SHAPE SIZE AND LOCATION OF AN ACTIVE HEAT SINK WITHIN A LAPTOP

机译：在笔记本电脑内优化形状尺寸和主动散热器的位置
- 作者：Antoine Dozolme;Maximilien Landrain;Hossam M. Metwally;Dimitri P. Tselepidakis
- 会议名称：《Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2006年
- Optimization;
- Airflow;
- Modeling;
- Fan;
- Fins;
- Heat sink;
- CFD;
36.HEAT TRANSPORT CHARACTERISTICS OF THE CAPILLARY PUMPED LOOP FOR COOLING THE TOWER-TYPE COMPUTER -2nd REPORT: CONSIDERING THE INCLINATION OF THE EVAPORATOR

机译：用于冷却塔式计算机的毛细管泵送环的热传输特性-2ND报告：考虑蒸发器的倾斜度
- 作者：Atsushi TSUJIMORI;Masashi KATO;Maiko UCHIDA
- 会议名称：《Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2006年
- Capillary pumping;
- Cooling device;
- Heat transfer;
- Heat transport;
- Thermal resistance;
- Evaporator;
- Wick;
37.SIMULATION OF Sn-0.7Cu SOLDER WITH BODNER-PARTOM CONSTITUTIVE MODEL

机译：用Bodner-Partom构成模型模拟Sn-0.7Cu焊料
- 作者：Ying He;Xu Chen;Ning Bai
- 会议名称：《Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2006年
- Sn-0.7Cu;
- Lead-free solder;
- Stress-strain response;
- Rate-dependence;
- Bodner-Partom constitutive model;
38.HIGH CAPACITY, COMPACT HYBRID AIR COOLING SYSTEM

机译：高容量，紧凑型混合空气冷却系统
- 作者：Daxi Xiong;Kaveh Azar;Bahman Tavassoli
- 会议名称：《Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2006年
- Hybrid cooling;
- Electronics cooling;
- Forced thermal spreader;
- Manifold heat sink;
- Pump;
- Microchannel;
- Minichannel;
39.EVALUATION OF SOLID-STATE TEMPERATURE CONTROL OF SILICON PACKAGES

机译：硅包装固态温度控制评价
- 作者：John P. Dirner;Celienid Lopez;Suzana Prstic;Steve Cass
- 会议名称：《Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2006年
- Thermoelectric;
- Calibration;
- Temperature sensors;
- Resistance temperature detectors;
40.EXPERIMENTAL FLOW VISUALIZATION AND ANALYTIC THERMAL MODELING OF MULTI-CHANNEL WALL FOR ELECTRONICS

机译：电子器件多通道墙体的实验流程可视化与分析热建模
- 作者：Kazuaki Yazawa;Hiroshi Yoshino;Shinji Nakagawa;Masaru Ishizuka
- 会议名称：《Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2006年
- Channel convection;
- PIV;
- Passive cooling;
41.EXPERIMENTAL CHARACTERIZATION OF THE TEMPERATURE DEPENDENCE OF THE PIEZORESISTIVE COEFFICIENTS OF SILICON

机译：硅压阻系数温度依赖性的实验表征
- 作者：Chun H. Cho;Richard C. Jaeger;Jeffrey C. Suhling
- 会议名称：《Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2006年
- Piezoresistance;
- Piezoresistive Coefficients;
- Stress Test Chip;
- Stress;
- Cryogenic;
42.Impact of Scaling on Thermal Behavior of Silicon-on-Insulator Transistors

机译：缩放对绝缘体晶体管热行为的影响
- 作者：Keivan Etessam-Yazdani;Rozana Hussin;Mehdi Asheghi
- 会议名称：《Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2006年
43.DESIGN, FABRICATION AND TEST OF SILICON HEAT PIPES WITH RADIAL MICROCAPILLARY GROOVES

机译：径向微毛细管槽的设计，制造和测试硅热管
- 作者：M. Ivanova;A. Lai;C. Gillot;N. Sillon;C. Schaeffer;F. Lefevre;M. Lallemand;E. Fournier
- 会议名称：《Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2006年
- Heat pipe;
- Silicon;
- Spreading;
- Miniature;
- Radial structure;
44.CAVITY-INDUCED TWO-PHASE HEAT TRANSFER IN SILICON MICROCHANNELS

机译：芯片微通道中的腔诱导的两相热传递
- 作者：Daniel T. Pate;Rory J. Jones;Sushil H. Bhavnani
- 会议名称：《Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2006年
45.Multi-Chip Package Thermal Management of IBM z-Server Systems

机译：IBM Z-Server系统的多芯片封装热管理
- 作者：Kamal Sikka;David Edwards;Patrick Coico;Lewis Goldmann;Amilcar Arvelo;Gaetano Messina;Sushumna Iruvanti;Frank Pompeo;Randall Werner;James Humenik;Donald Scheider;Jasvir Jaspal;Alice Tai;Barrie Campbell;Chris Piasecki;Surinder Singh
- 会议名称：《Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2006年
- MCM;
- Thermal Management;
- Advanced Thermal Compound;
- Thermal Paste;
- Thermal Grease;
46.Thermal performance of cooling system for red, green and blue LED light source for rear projection TV

机译：用于后投电视的红色，绿色和蓝色LED光源冷却系统的热性能
- 作者：Sung Ki Kim;Seo Young Kim;Young Don Choi
- 会议名称：《Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2006年
- Light Emitting Diode (LED);
- Thermal management;
- Rear Projection TV;
47.DEVELOPMENT OF BALL IMPACT TEST SYSTEM

机译：球冲击试验系统的发展
- 作者：Chang-Lin Yeh;Yi-Shao Lai
- 会议名称：《Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2006年
- Ball impact test (BIT);
- Solder joint;
- Structural dynamics;
- Intermetallic compound (IMC);
- High strain rate;
48.DEGRADATION OF THERMAL PERFORMANCE OF BALL GRID ARRAYS AFTER THERMAL CYCLING

机译：热循环后球栅阵列的热性能的劣化
- 作者：Roy W. Knight;Yasser Elkady;Jeffrey C. Suhling;Pradeep Lall
- 会议名称：《Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2006年
49.The Impact of a Thermal Spreader on the Temperature Distribution in a Plasma Display Panel

机译：热散布器对等离子显示板温度分布的影响
- 作者：Amir Shooshtari;Jeffry Kahn;Avram Bar-Cohen;Serguei Dessiatoun;Michael Ohadi;Matt Getz;Julian Norley
- 会议名称：《Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2006年
- Plasma Display Panel;
- Heat Spreader;
- Thermal Management;
- Natural Graphite;
- Luminosity;
50.UNSTEADY EFFECTS OF A PAIR OF OPPOSED CONFINED IMPINGING AIR JETS AND APPLICATION TO MICROELECTRONICS COOLING

机译：一对对抗局限于撞击空气喷射和应用于微电子冷却的不稳定效果
- 作者：Victor Adrian Chiriac;Jorge Luis Rosales
- 会议名称：《Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2006年
- Opposite;
- Confined;
- Impinging;
- Jets;
- Cooling;
- Unsteady;
- Laminar;
51.COMPUTATIONAL METHOD FOR CHARACTERIZATION OF A MICROCHANNEL HEAT SINK WITH MULTIPLE CHANNELS INVOLVING TWO-PHASE FLOW

机译：具有涉及两相流的多通道的微通道散热器的表征计算方法
- 作者：Kanchan M. Kelkar;Suhas V. Patankar;Sukhvinder Kang
- 会议名称：《Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2006年
52.Experiments and Modeling of Multilayer Copper Minichannel Heat Sinks in Single-Phase Flow

机译：单相流中多层铜蓄热散热器的实验与建模
- 作者：N. Lei;P. Skandakumaran;A. Ortega
- 会议名称：《Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2006年
- Minichannel;
- Microchannel;
- Liquid cooling;
- Cold plate;
- Stacked;
- Multilayer;
53.Easy reliability design approach for solder joint BGA package considering correlation of each design factor

机译：考虑每个设计因素的相关性，焊接联合BGA包装易于可靠性设计方法
- 作者：Qiang YU;Tadahiro SHIBUTANI;Jae-Chul JIN;Satoshi KONDO;Masaki SHIRATORI
- 会议名称：《Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2006年
54.Optimization of Reliability of Wafer Level Copper Column Interconnections Using a Variable Compliance Interconnect Design

机译：使用可变合规性互连设计优化晶圆级铜柱互连的可靠性
- 作者：Andrew A. O. Tay;Wei Sun
- 会议名称：《Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2006年
55.Dynamic Thermal Management of Air Cooled Data Centers

机译：空气冷却数据中心的动态热管理
- 作者：Cullen E. Bash;Chandrakant D. Patel;Ratnesh K. Sharma
- 会议名称：《Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2006年
- Data center cooling;
- Smart cooling;
- Dynamic thermal control;
- Thermal management;
- Dynamic thermal management;
56.FAILURE RATE PREDICTION AND PREVENTION OF DIE CRACKING IN OVER MOLDED PLASTIC PACKAGES

机译：模压塑料包装中模具裂缝的故障率预测及防止
- 作者：Bhuvaneshwaran Vijayakumar;Yifan Guo
- 会议名称：《Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2006年
- Solder mask;
- Design;
- Die strength;
- Bending stress;
- Three point bending;
- Flexure strength;
57.EFFECTS OF SURFACE ROUGHNESS AND OXIDE LAYER ON WAFER BONDING STRENGTH USING TRANSMISSION LASER BONDING TECHNIQUE

机译：用透射激光粘接技术对表面粗糙度和氧化物层对晶片键合强度的影响
- 作者：Ampere A. Tseng;Jong-Seung Park
- 会议名称：《Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2006年
- Bonding Strength;
- MEMS Packaging;
- Pyrex Glass;
- Silicon;
- Transmission Laser Bonding;
- Wafer bonding;
58.Multi-resolution Simulation and Design Tool For Thermal Management of Electronics Packages in Complex Systems

机译：复杂系统中电子包热管理的多分辨率仿真与设计工具
- 作者：Ashok Raman;Maciej Pindera;Patrick Wilkerson;Marek Turowski
- 会议名称：《Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2006年
- Thermal management of electronics;
- Simulation;
- CFD;
- System-level tools;
- Mixed-resolution;
- ANN;
- Artificial neural nets;
59.COTS IN SPACE: DEVELOPING AN ENVIRONMENTAL CONTROL SYSTEM FOR BALLOON-BORNE AIR-COOLED ELECTRONICS

机译：空间中的婴儿床：开发气球传播空气冷却电子的环境控制系统
- 作者：Angela Minichiello
- 会议名称：《Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2006年
- Thermal management;
- Climate sensor electronics;
- Balloon thermal analysis;
60.Cooling Orthogonally Packaged Switch Architectures

机译：冷却正交包装的交换机架构
- 作者：Andreas C. Pfahnl;Christopher S. Heard
- 会议名称：《Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2006年
- Orthogonal architecture;
- Front-to-back cooling;
- Liquid cooling;
- Rackmount cooler;
- Radiator;
- Heat exchanger;
61.A Review of Convective Heat Transfer with Nanofluids for Electronics Packaging

机译：用电子包装纳米流体对流热传递综述
- 作者：W. Y. Lai;B. Duculescu;P. E. Phelan;Ravi Prasher
- 会议名称：《Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2006年
- Nanofluid;
- Convection;
- Electronic packaging;
62.MODELING OF VAPOR CHAMBER AS HEAT SPREADING DEVICES

机译：蒸汽室建模作为散热装置
- 作者：Xiaojin Wei;Kamal Sikka
- 会议名称：《Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2006年
- Vapor chamber;
- Heat spreader;
- Thermal management;
- Electronic-cooling;
63.Coupled Thermal/Electrical Analysis of High Powered Electrical Systems

机译：高动力电气系统的耦合热/电气分析
- 作者：Ben Zandi;Jeffrey Lewis;Hamish Lewis;Majid Keyhani
- 会议名称：《Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2006年
64.THE OPTIMIZATION OF A REFRIGERATION VAPOR COMPRESSION SYSTEM FOR POWER MICROELECTRONICS

机译：电力微电子制冷蒸汽压缩系统的优化
- 作者：Victor Chiriac;Florea Chiriac
- 会议名称：《Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2006年
- Vapor;
- Compression;
- Refrigeration;
- Microchannels;
- Power electronics;
- Cooling;
65.EXPERIMENTAL AND NUMERICAL ANALYSIS OF MISALIGNMENT MECHANISM IN ANISOTROPIC CONDUCTIVE FILM ASSEMBLY

机译：各向异性导电膜组件中未对准机制的实验与数值分析
- 作者：Bin Xie;Xunqing Shi;Han Ding;Kai Qiao
- 会议名称：《Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2006年
- Anisotropic conductive film (ACF);
- Chip-on-glass (COG);
- Misalignment;
- Simulation;
- Thermal;
66.THEORETICAL MODEL BASED THERMAL STUDIES ON STACKED DIES

机译：基于理论模型堆叠模具的热研究
- 作者：Manish Saini
- 会议名称：《Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2006年
- Boundary condition;
- Hottest die;
- Resistance;
- Steady-state;
- Theoretical model;
- Thermal metric;
67.SPRAY COOLING OF HIGH ASPECT RATIO OPEN MICROCHANNELS

机译：高纵横比打开微通道的喷雾冷却
- 作者：Johnathan S. Coursey;Jungho Kim;Kenneth T. Kiger
- 会议名称：《Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2006年
- Convective heat transfer;
- Thermal management;
- Fins;
- Heat sink;
- Evaporation;
- Two-phase;
- Convection;
- Efficiency;
68.EFFECTS OF PIN-FINNED CONDENSING SURFACES ON POOL BOILING IN FC-72

机译：尖翅凝结表面对FC-72池沸腾的影响
- 作者：Sarng Woo Karng;Tae Ho Ji;Seo Young Kim
- 会议名称：《Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2006年
- Pin-finned surface;
- Array spacing;
- Superheat;
- Hysteresis phenomenon;
- Hysteresis;
69.SMALL SCALE REFRIGERATION SYSTEM FOR ELECTRONICS COOLING WITHIN A NOTEBOOK COMPUTER

机译：用于笔记本电脑内电子冷却的小规模制冷系统
- 作者：Rajiv Mongia;Kuroda Masahiro;Eric DiStefano;Jim Barry;Weibo Chen;Mike Izenson;Fabricio Possamai;Augusto Zimmermann;Masataka Mochizuki
- 会议名称：《Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2006年
- Electronics cooling;
- Vapor-compression refrigeration;
- Evaporators;
- Condensers;
- Compressors;
70.Cohesive Modeling of Solder Interconnect Failure in Board Level Drop Test

机译：焊料互连失效的粘性建模课级跌落试验
- 作者：P. Towashiraporn;C. Xie
- 会议名称：《Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2006年
- Solder;
- Failure;
- Finite Element Analysis;
- Crack propagation;
- Drop;
- Impact;
- Cohesive;
71.The Need for Temperature-Aware Storage Systems

机译：需要温度感知存储系统
- 作者：Sudhanva Gurumurthi
- 会议名称：《Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2006年
- Storage System;
- Disk Drives;
- Power and Temperature Management;
72.DATA CENTER POWER PROJECTIONS TO 2014

机译：数据中心电力投影到2014年
- 作者：Christian Belady;Christopher Malone
- 会议名称：《Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2006年
- Data center;
- Power trend;
- ASHRAE;
- Uptime;
- Projections;
73.Applications of speckle metrology to vibration and deformation measurements of electronic devices

机译：斑点计量在电子设备振动和变形测量中的应用
- 作者：G. C. Jin;X. F. Yao;N. K. Bao
- 会议名称：《Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2000年
- Electronic device testing;
- Digital speckle correlation;
- Wavelet noise reduction;
74.Experimental study on performance of a miniature heat pipe with woven-wired wick

机译：用梭织有线芯的微型热管性能的实验研究
- 作者：Seok Hwan Moon;Choon Gi Choi;Gunn Hwang;Tae Goo Choy
- 会议名称：《Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2000年
- Operating factors;
- Electronic cooling;
- Heat sink;
- Capillary pressure;
- Limiting power;
- Wick structure;
75.Advanced thermal tester accurate measurement of internal thermal resistance of high power electronic modules

机译：先进的热测试仪精确测量高功率电子模块的内部热阻
- 作者：K. K. Sikka
- 会议名称：《Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2000年
- Thermal measurements;
- Electronics cooling;
- Internal thermal resistance;
- Interface materials;
76.A novel heat sink design for low speed flows - a BGA example

机译：低速流动的新型散热器设计 - BGA示例
- 作者：Bahman Tavassoli
- 会议名称：《Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2000年
- Fin field;
- Heat sink;
- Pressure drop;
77.A method to predict failure of solder joints caused by thermal shock using finite element analysis for RF power amplifier applications

机译：使用RF功率放大器应用的有限元分析预测热冲击引起的焊点失效的方法
- 作者：Michael C. Yang;Matt Cienkus;Michael Hajovsky;Tom Basey
- 会议名称：《Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2000年
78.Vibration-induced droplet cooling of microelectronic components

机译：微电子元件的振动诱导的液滴冷却
- 作者：S. N. Heffington;W. Z. Black;A. Glezer
- 会议名称：《Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2000年
- Two-phase cooling;
- Vibration induced droplet breakup;
- Droplet cooling;
- Thermal management of microelectronics;
79.Numerical simulation of interfacial delamination in electronic packaging

机译：电子包装中界面分层的数值模拟
- 作者：B. Wang;X. Sun;Q. S. Fan;Y. Yin
- 会议名称：《Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2000年
- Interfacial fracture mechanics;
- FEM;
- BEM;
- Crack propagation;
- Thermal stress;
- electronic packaging;
80.Optimization of the ArctiCooler for lowest thermal resistance in a minimum volume

机译：在最小体积中优化Arcticooler以最低的热阻
- 作者：Cuy R. Wagner
- 会议名称：《Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2000年
- ArctiCooler;
- TurboCooler;
- Fansink;
- Heat sink;
- Processor cooling;
- Impingement cooling;
81.Inelastic behavior of microelectronics solder joints under concurrent vibration and thermal cycling

机译：同时振动和热循环下微电子焊点的非弹性行为
- 作者：Y. Zhao;C. Basaran;A. Cartwright;T. Dishongh
- 会议名称：《Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2000年
- Concurrent cycling;
- Moire interferometry;
- Thermal cycling;
- Vibration;
- Fatigue life;
- Inelastic behavior;
- BGA package;
- Cyclic stabilization;
- Damage evolution;
82.Modelling technology to predict flip-chip assembly

机译：建模技术预测倒装芯片组件
- 作者：D. Wheeler;C. Bailey
- 会议名称：《Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2000年
- Modelling;
- Flipchip;
- Curing;
- Reflow;
83.Stress/strength and reliability evaluations on UBM in different solder systems

机译：不同焊料系统中UBM的应力/强度和可靠性评估
- 作者：Yifan Guo;Shun-Meen Kuo;Lei Mercado
- 会议名称：《Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2000年
84.Preliminary examination of the modified lower-bound meso-damage constitutive model for porous materials

机译：对多孔材料改性的较低近近的中间损伤本构模型的初步检查
- 作者：Yajun Yin;Qinshan Fan;Bo Wang
- 会议名称：《Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2000年
- Porous materials;
- Mico void interaction;
- Rigid-plastic;
- Modified lower bound constitutive model;
85.A practical die stress model and its applications in flip-chip packages

机译：实用的模具应力模型及其在倒装芯片封装中的应用
- 作者：Yifan Guo;Jie-Hua Zhao
- 会议名称：《Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2000年
86.Thermomechanical behavior of BGA solder joints under vibrations: an experimental observation

机译：BGA焊点下的热机械行为在振动下：实验观察
- 作者：Y. Zhao;C. Basaran;A. Cartwright;T. Dishongh
- 会议名称：《Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2000年
- Thermomechanical behavior;
- Vibration;
- BGA solder joint;
- Shock;
- Moire interferometry;
- Fatigue life;
- Nonlinear stress-strain behavior;
- Concurrent loading;
87.Conjugate mixed convection in a cooling duct

机译：在冷却管道中共轭混合对流
- 作者：Claudia R. Andrade;Edson L. Zaparoli
- 会议名称：《Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2000年
- Air-cooled heat sink;
- Mixed convection;
- Conjugated problem;
- Fins;
88.Characterisation of die attach for power devices using thermal impedance measurement practice and experiment

机译：使用热阻抗测量实践和实验的电力器件模具的特征
- 作者：Matthias Ludwig;Alexander Gaedke;Orla Slattery;John Flannery;Sean Cian OMathuna
- 会议名称：《Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2000年
- Cooling curve measurement;
- CFD-modelling;
- Temperature fixed heatsink;
- Direct water cooling;
89.A novel method of cooling electronic packages using a porous channel heat sink subjected to oscillating flow

机译：一种使用多孔沟道散热器的冷却电子封装的新方法进行振动流动
- 作者：H. L. Fu;K. C. Leong;X. Y. Huang;C. Y. Liu
- 会议名称：《Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2000年
- Porous media;
- Heat transfer;
- Electronic cooling;
- Oscillating flow;
90.Modeling contact between rigid sphere and elastic layer bonded to rigid substrate

机译：刚性球体与刚性基板的弹性层之间的建模接触
- 作者：Mirko Stevanovic;M. M. Yovanovich;J. R. Culham
- 会议名称：《Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2000年
- Contact radius;
- Elastic deformation;
- Elastomer layers;
- Thermal constriction resistance;
91.A comparison of using Icepak and Flotherm in electronic cooling

机译：使用ICEPAK和Flothm在电子冷却中的比较
- 作者：Michael C. Yang
- 会议名称：《Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2000年
92.Experimental verification of a model for the optimization of pin fin heatsinks

机译：销钉散热器优化模型的实验验证
- 作者：Trevor Zapach;Todd Newhouse;Jeff Taylor;Peter Thomasing
- 会议名称：《Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2000年
- Inline pins;
- Staggered pins;
93.A comparison between moire interferometry and strain gages for effective CTE measurement in electronic packages

机译：电子封装中有效CTE测量莫尔干涉测量和应变计的比较
- 作者：T. Ratanawilai;B. Hunter;G. Subbarayan;D. Rose
- 会议名称：《Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2000年
- Moire interferometry;
- Strain gage technique;
- Effective CTE;
- Thermal strain;
- Accuracy;
94.Computational parameter study of chip scale package array cooling

机译：芯片尺度包阵列冷却的计算参数研究
- 作者：Sean P. Watson;Bruce T. Murray;Bahgat G. Sammakia
- 会议名称：《Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2000年
- Chip scale package;
- FLOTHERM;
- Thermal management;
- Electronics packaging;
95.Finite-element modeling of thermal and thermomechanical behavior of three-dimensional packaging of power electronics modules

机译：电力电子模块三维封装热量和热机械行为的有限元模型
- 作者：Simon Wen;Guo-Quan Lu
- 会议名称：《Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2000年
- Thermal;
- Thermomechanical;
- Finite element modeling;
- 3-D power packaging;
96.Study of thermal characteristics on solder and adhesive bonded folded fin heat sink

机译：焊料粘结折叠翅片散热器的热特性研究
- 作者：C. K. Loh;Bor-Bin Chou;Dan Nelson;D. J. Chou
- 会议名称：《Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2000年
- Solder bonded fin;
- Adhesive bonded fin;
- Bonding thermal resistance;
- Folded fin heat sink;
- Forced convection;
- Air cooled;
97.Estimation of the thermal-mechanical fatigue behavior of Sn/Pb solder joints

机译：SN / PB焊点的热机械疲劳行为估算
- 作者：Xi-Shu Wang;Shou-Wen Yu;Norio Kawagoishi
- 会议名称：《Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2000年
- Thermal-mechanical coupling;
- Crack growth rate;
- Solder joints;
- Equivalent plastic strain range;
98.Wafer-level packaging technology for MEMS

机译：MEMS的晶圆级包装技术
- 作者：A. R. Mirza
- 会议名称：《Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2000年
99.IGBT package design for high power aircraft electronic systems

机译：高电机电子系统的IGBT包装设计
- 作者：Farhad Sarvar;David C. Whalley
- 会议名称：《Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2000年
- Thermal design;
- Heatsink;
- Modelling;
100.High heat flux heat pipe mechanism for cooling of electronics

机译：高热通量热管机构，用于冷却电子产品
- 作者：Z. J. Zuo;M. T. North;K. L. Wert
- 会议名称：《Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2000年
- Pulsating heat pipe;
- Wick structure;
- High heat flux cooling;