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Semiconductor device capable of reducing a contact resistance of a lower electrode and a contact pad and providing an align margin between the lower electrode and the contact pad
Semiconductor device capable of reducing a contact resistance of a lower electrode and a contact pad and providing an align margin between the lower electrode and the contact pad
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机译:能够降低下电极和接触垫的接触电阻并在下电极和接触垫之间提供对准裕度的半导体器件
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摘要
A semiconductor device includes an insulation interlayer and an etch stop layer sequentially stacked on a substrate wherein a lower structure including a first contact pad is formed. A second contact pad penetrates the insulation interlayer and the etch stop layer and is connected to the first contact pad. The second contact pad protrudes from the etch stop layer. A pad spacer is provided between the second contact pad and the insulation interlayer. A lower electrode is provided on the etch stop layer and is connected to the second contact pad. A dielectric layer and an upper electrode are sequentially provided on the lower electrode.
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