SEMICONDUCTOR DEVICE INCLUDING COLUMNAR ELECTRODES AND A METHOD FOR MANUFACTURING THE SAME, CAPABLE OF INCREASING THE GAP BETWEEN THE CONNECTION PADS OF THE WIRING AND THE COLUMNAR ELECTRODES

摘要

PURPOSE: A semiconductor device including columnar electrodes and a method for manufacturing the same are provided to draw wirings without a limitation by forming the planar size of the columnar electrodes to be larger than the planar size of the connection pads of the wirings.;CONSTITUTION: A connection pad(2) is connected to an integrated circuit along the one side of a semiconductor substrate(1). The center part of the connection pad is exposed through an opening(4) which is installed on an insulation layer(3). A first insulation layer(5) is installed on the upper side of the semiconductor substrate. A first wiring is installed on the upper side of the first insulation layer. A second wiring is expanded through the gap between the connection pads of the first wiring. The planar size of columnar electrodes(13) is larger than the planar size of the connection pads of the first and the second wirings.;COPYRIGHT KIPO 2010