POLYMER HOT-WIRE CHEMICAL VAPOR DEPOSITION IN CHIP SCALE PACKAGING

摘要

Embodiments of the present invention provide a vapor phase organic polymer film deposited using a CVD process at low temperature during a process sequence for wafer-level chip scale packaging (WL-CSP), including system-in package (SiP), Package-on-Package (PoP) and Package-in-Package (PiP).