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Epitaxial substrate for semiconductor device, schottky junction structure, and leakage current suppression method for schottky junction structure

机译:用于半导体器件的外延衬底,肖特基结结构以及用于肖特基结结构的泄漏电流抑制方法

摘要

Provided is an epitaxial substrate (10) for semiconductor device that is capable of achieving a semiconductor device having high reliability in reverse characteristics of schottky junction. An epitaxial substrate (10) for semiconductor device obtained by forming, on a base substrate (1), a group of group III nitride layers by lamination such that a (0001) crystal plane of each layer is approximately parallel to a substrate surface includes: a channel layer (3) formed of a first group III nitride having a composition of Inx1Aly1Gaz1N (x1+y1+z1=1, z10); and a barrier layer (5) formed of a second group III nitride having a composition of Inx2Aly2N (x2+y2=1, x20, y20), wherein the second group III nitride is a short-range-ordered mixed crystal having a short-range order parameter α satisfying a range where 0α1.
机译:提供一种用于半导体器件的外延衬底(10),其能够获得在肖特基结的反向特性方面具有高可靠性的半导体器件。通过在基底基板(1)上通过层叠形成一组III族氮化物层以使每一层的(0001)晶面大致平行于基板表面而获得的用于半导体器件的外延基板(10)包括:沟道层(3),其由具有Inx1Aly1Gaz1N(x1 + y1 + z1 = 1,z1> 0)的第一III族氮化物形成;以及由具有Inx2Aly2N(x2 + y2 = 1,x2> 0,y2> 0)组成的第二III族氮化物形成的阻挡层(5),其中第二III族氮化物是短程混合晶体具有满足0 <α<1的范围的短程顺序参数α。

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