INTERPOSER FOR PROVIDING CAPACITANCE AND LEAD FRAME TYPE SEMICONDUCTOR PACKAGE USING THE SAME

摘要

capacitance, the following description is provided by the Inter pojyeo PCB (Printed Circuit Board Interposer) and it used a lead frame Type (Lead Frame Type) is for a semiconductor package. Specifically, the semiconductor package according to the invention QFN (Quad-flat no-leads package) method or QFP (Quad Flat Package) a lead frame for a method (Lead Frame) The substrate formed; Is formed on top of the substrate and the leadframe QFP or QFN way connectable circuit members; And is formed by one or more built-in capacitors (Capacitor) The circuit member connected to the substrate or possible between the substrate and the circuit member, vertically connected through a connecting member to a specific position and the specific position of the substrate of the circuit member The interface is characterized in that it includes the inter pojyeo PCB (Printed Circuit Board Interposer) to provide. ;