DNP's Lead Frame Eyes Slimmest Semiconductor Package

摘要

Dai Nippon Printing Co., Ltd. (DNP) has paved way for the creation of the smallest semiconductor package to date, featuring a thickness of 0.15mm, with the development of a new lead frame. This progress was made in response to efforts to slim down the semiconductor packages mounted on electronic devices, like mobile terminals and personal computers.rnThe new packaging developed by DNP differs from the present format created by mounting the IC chip on top of the lead-frame. DNP has established a technology, which leaves only the necessary circuit portion of the lead frame, removes the plate mounting for the IC chip, and in cases where it is structurally demanded, etches the lead frame portion used for mounting the IC chip into a concave shape, into which the IC chip is embedded.