A Apparatus for Heating Substrates in High Vacuum Chamber, Apparatus for Aligning Substrates Having the Same and Heating Apparatus Using FIR

摘要

The present invention relates to a substrate heating apparatus in a high vacuum chamber, a substrate aligning apparatus including the same and a heating apparatus using a far infrared ray, which can assure thermal uniformity by a heater pattern easily and can perform high temperature heating as having a simple structure of the whole apparatus, by heating a substrate uniformly using a far infrared ray plate heater radiating far infrared ray radiation with high efficiency in a chamber of high vacuum atmosphere. A substrate heating apparatus of the present invention includes: a chamber for forming a closed space of high vacuum atmosphere; a far infrared ray plate heater for heating a substrate installed in the chamber using far infrared rays; the substrate touching the bottom of the far infrared ray plate heater; a mask touching the bottom of the substrate in order to form a desired pattern on the substrate; and a heating line for supplying power to the far infrared ray plate heater.