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SUBSTRATE PROCESSING APPARATUS, CAPABLE OF UNIFORMLY HEATING A SUBSTRATE HOLDER AND THE INSIDE OF A CHAMBER USING A LOWER HEATING UNIT
SUBSTRATE PROCESSING APPARATUS, CAPABLE OF UNIFORMLY HEATING A SUBSTRATE HOLDER AND THE INSIDE OF A CHAMBER USING A LOWER HEATING UNIT
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机译:基板处理设备,能够均匀加热基板支架,并使用较低的加热单元在腔室内
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摘要
PURPOSE: A substrate processing apparatus is provided to prevent an inactive gas from being diffused to the upper side of the chamber and prevent an inner gas of the upper side of the chamber from being diffused to the lower side of the chamber by positioning the substrate holder on the upper side of an edge ring.;CONSTITUTION: A chamber provides a reactive space. A substrate holder(120) is positioned on the reactive space and has a peripheral region. An edge ring(130) is inserted into the peripheral region of the substrate holder and is comprised of an upper ring positioned on the upper side of the peripheral region and a lower ring positioned on the lower side of the peripheral region. Upper and lower heating units(122,128) are installed on the upper side and the lower side of the chamber and heat the substrate.;COPYRIGHT KIPO 2010
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