Pb-FREE Au-Ge-Sn-BASED SOLDER ALLOY MAINLY CONTAINING Au

摘要

PROBLEM TO BE SOLVED: To provide a Pb-free solder alloy for high temperature which is excellent in various properties such as processability and the like, which can be sufficiently used even at a joint required for high reliability and which is inexpensive while Au is a main component.;SOLUTION: In a solder alloy where the content of Ge is 0.01 mass% or more and 10.0 mass% or less, the content of Sn is 32.0 mass% or more and 40.0 mass% or less, one or more kinds among Al, Cu, Mg, Ni, Sb and Zn is contained and the balance is composed of Au and inevitable impurities, the content of Al when being contained is 0.01 mass% or more and 1.5 mass% or less, the content of Cu when being contained is 0.01 mass% or more and 1.0 mass% or less, the content of Mg when being contained is 0.01 mass% or more and 0.8 mass% or less, the content of Ni when being contained is 0.01 mass% or more and 1.0 mass% or less, the content of Sb when being contained is 0.01 mass% or more and 0.8 mass% or less and the content of Zn when being contained is 0.01 mass% or more and 3.0 mass% or less.;COPYRIGHT: (C)2015,JPO&INPIT