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Current Situation and Issues of Soldering Technology in the Pb-Free Solder Age. The Present Situation for Lead Free Solder Alloy Development.

机译：PB免焊期焊接技术的现状及问题。无铅焊料合金发育现状。

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Tetsuya OKUNO; Osamu MUNEKATA;
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年度 1996
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1. Filler materials: the current situation and future trends with particular reference to lead-free soldering alloys [J] . B ZACCARIA Welding International . 2001,第7期

机译：填充材料：特别是无铅焊接合金的现状和未来趋势
2. Present Situation of the Plating Technology for Lead-Free Soldering [J] . Susumu Arai, Norio Kaneko, Naoyuki Shinohara 表面技術 . 2001,第5期

机译：无铅焊接电镀技术的现状
3. TRENDS IN WETTABILITY STUDIES OF Pb-FREE SOLDERS. BASIC AND APPLICATION. PART II. RELATION BETWEEN SURFACE TENSION, INTERFACIAL TENSION AND WETTABILITY OF LEAD-FREE Sn-Zn AND Sn-Zn-Bi-Sb ALLOYS [J] . K. BUKAT, Z. MOSER, W. GASIOR Archives of Metallurgy and Materials . 2008,第4期

机译：无铅焊料润湿性研究的趋势。基础和应用。第二部分无铅Sn-Zn和Sn-Zn-Bi-Sb合金的表面张力，界面张力与可湿性的关系
4. NEW GENERATION OF Pb-FREE SOLDER ALLOYS: POSSIBLE SOLUTION TO SOLVE CURRENT ISSUES WITH MAIN STREAM Pb-FREE SOLDERING [C] . Polina Snugovsky, Simin Bagheri, Marianne Romansky, International Conference on Soldering and Reliability . 2013

机译：新一代无铅焊料合金：可能解决主流无铅焊接当前问题的解决方案
5. Investigation of Mixed Solder Assemblies & Novel Lead-Free Solder Alloys [D] . Kaila, Rishi 2011

机译：混合焊料组件和新型无铅焊料合金的研究
6. A Computational Thermodynamics-Assisted Development of Sn-Bi-In-Ga Quaternary Alloys as Low-Temperature Pb-Free Solders [O] . Chih-han Yang, Shiqi Zhou, Shih-kang Lin, 2019

机译：Sn-Bi-In-Ga四元合金低温无铅焊料的计算热力学辅助开发
7. Current Situation and Issues of Soldering Technology in the Pb-Free Solder Age. The Comparison of Lead-Free Solder and Sn/Pb Eutectic Solder for Mountability. [O] . Junichi INOUE 1996

机译：PB免焊期焊接技术的现状及问题。无铅焊料和Sn / Pb共晶焊料的可安装性的比较。
8. Wave soldering with Pb-free solders [R] . Artaki, I. , Finley, D. W. , Jackson, A. M. , 1995

机译：使用无铅焊料进行波峰焊

Current Situation and Issues of Soldering Technology in the Pb-Free Solder Age. The Present Situation for Lead Free Solder Alloy Development.

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