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Characterization of Low Melting Temperature, Low-Ag, Bi-Containing, Pb-Free Solder Alloys

机译：低熔点，低Ag，含双Pb焊料合金的表征

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作者
Kosiba, Eva.;
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作者单位

University of Toronto (Canada).;

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授予单位 University of Toronto (Canada).;
学科
学位 M.A.S.
年度 2016
页码 205 p.
总页数 205
原文格式 PDF
正文语种 eng
中图分类 AAI10129964;
关键词
Bismuth; Pb-free; Reliability; Solder;

机译：铋;无铅;可靠性;焊接;
入库时间 2022-08-17 12:02:11

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1. Development of Sn-Based, Low Melting Temperature Pb-Free Solder Alloys [J] . Paul Vianco, Jerome Rejent, Richard Grant Materials transactions . 2004,第3期

机译：锡基低熔点无铅焊料合金的开发
2. Tin Whisker Growth on Electronic Assemblies Soldered with Bi-Containing, Pb-Free Alloys [J] . Delhaise Andre M., Bagheri Zohreh, Meschter Stephan, Journal of Electronic Materials . 2021,第3期

机译：电子组件上的锡晶须增长用含双含Pb的合金焊接
3. Microstructure Characterization and Creep Behavior of Pb-Free Sn-Rich Solder Alloys: Part I. Microstructure Characterization of Bulk Solder and Solder/Copper Joints [J] . R.S. Sidhu, N. Chawla Metallurgical and Materials Transactions A . 2008,第2期

机译：无铅富锡焊料合金的微观结构表征和蠕变行为：第一部分。大块焊料和焊料/铜接头的微观结构表征
4. Effects of Bi and Ni Addition on Wettability and Melting Point of Sn-0.3Ag-0.7Cu Low-Ag Pb-free Solder [C] . Jin Chen, Xiao-hua Luo Proceedings of 2008 international conference on electronic packaging technology high density packaging (ICEPT-HDP 2008) . 2008

机译：Bi和Ni的添加对Sn-0.3Ag-0.7Cu低Ag无铅焊料的润湿性和熔点的影响
5. Containerless melting and characterization of cast magnesium AZ31-B alloy at low superheat in the magnetic suspension melting process [D] . Rimkus, Nathan Wayne 2011

机译：磁悬浮熔化过程中低过热度铸镁AZ31-B合金的无容器熔化和表征
6. A Computational Thermodynamics-Assisted Development of Sn-Bi-In-Ga Quaternary Alloys as Low-Temperature Pb-Free Solders [O] . Chih-han Yang, Shiqi Zhou, Shih-kang Lin, 2019

机译：Sn-Bi-In-Ga四元合金低温无铅焊料的计算热力学辅助开发
7. Effect Of Al Addition To Imc Formation, Mechanical And Wetting Properties Of Low-Ag Sac Solder Alloy [O] . Kamarudin Maslina 2015

机译：Al对低Ag囊状锡合金的IMc形成，力学性能和润湿性能的影响
8. Wettability of low temperature solder alloys for step-soldering. [R] . Hosking, F. M., Vianco, P. T., Frear, D. R. 1991

机译：用于阶梯焊接的低温焊料合金的润湿性。

Characterization of Low Melting Temperature, Low-Ag, Bi-Containing, Pb-Free Solder Alloys

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