METAL NANOPARTICLE PASTE, BONDING MATERIAL CONTAINING THE SAME, AND SEMICONDUCTOR DEVICE USING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a metal nanoparticle paste capable of forming a bonding layer having a high bonding strength at low temperature (specifically, 400°C or lower).SOLUTION: A metal nanoparticle paste contains 99.9-70 mass% of Cu nanoparticles and 0.1-30 mass% of Sn-transition metal intermetallic compound nanoparticles with respect to the total metal nanoparticles.