Metal nanoparticle paste, bonding material containing the same, and semiconductor device using the same

摘要

PROBLEM TO BE SOLVED: To provide a metal nanoparticle paste capable of forming a bonding layer having a high bonding strength at low temperature (specifically, 400°C or lower).SOLUTION: A metal nanoparticle paste contains 99.9-70 mass% of Cu nanoparticles and 0.1-30 mass% of Sn-transition metal intermetallic compound nanoparticles with respect to the total metal nanoparticles.