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Embedded Silver Nanomaterials into Die Backside to Enhance Package Performance and Reliability
Embedded Silver Nanomaterials into Die Backside to Enhance Package Performance and Reliability
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机译:将银纳米材料嵌入到芯片背面以提高封装性能和可靠性
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摘要
A method and apparatus for enhancing the electrical and thermal performance of semiconductor packages effectively, especially for laminated packages, where sinterable materials cannot be used. The concept of this invention is to embed silver or silver-coated nanomaterials, which can be nanoparticles, nanoflakes, nanowires etc., into die backside to improve the interface between die and die attach materials, thus enhancing electrical and thermal performance through sintering and enhancing reliability by improving adhesion.
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