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INTERCONNECTION OF SEVERAL LEVELS OF A STACK OF SUPPORTS FOR ELECTRONIC COMPONENTS
INTERCONNECTION OF SEVERAL LEVELS OF A STACK OF SUPPORTS FOR ELECTRONIC COMPONENTS
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机译:电子元件支持层的几个层次的互连
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摘要
Method for producing a microelectronic device formed from a stack of supports (W) each provided with one or more electronic components (C) and comprising a conductive structure (170, 470) formed from a first blind conductive via (171b, 472) and a second blind conductive via (171a, 473) with a greater height, the first via and the second via being connected together.
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