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Embedded chip package, a chip package, and a method for manufacturing an embedded chip package
Embedded chip package, a chip package, and a method for manufacturing an embedded chip package
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机译:嵌入式芯片封装,芯片封装以及用于制造嵌入式芯片封装的方法
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摘要
An embedded chip package is provided. The embedded chip package includes a plurality of chips; encapsulation material embedding the plurality of chips; at least one electrical redistribution layer electrically connected to the plurality of chips; and a common terminal connected to the at least one electrical redistribution layer, wherein the common terminal provides an interface to at least one of transmit and receive a common electrical signal between the plurality of chips and the common terminal.
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