METHOD TO ENHANCE RELIABILITY OF THROUGH MOLD VIA PACKAGE ON PACKAGE ASSEMBLIES

摘要

A Through Mold Via (TMV) Integrated Circuit (IC) package is provided as a bottom IC package (32) for a TMV Package on Package (POP) configuration. The TMV IC package has an overmold (50) top portion having a substantially flat surface (54) and spacer or standoff features (56, 58, 76, 78) extending upward from the flat surface. The spacer or standoff features are configured to abut the bottom surface of the top POP package (60) during softer reflow in order to maintain a gap (62) of predetermined height between the top (60) and bottom (32) IC packages.