SOLDER REWORK METHOD, SOLDER REWORK APPARATUS USING THE SAME AND BOARD INSPECTION METHOD EMPLOYING THE SAME

摘要

A solder rework method for compensating for insufficient solder formed on a circuit board comprises a step for forming an ideal solder structure by distributing ideal solder to predetermined calibration cells; a step for measuring a three-dimensional profile of solder formed on the circuit board and then dividing the measured three-dimensional profile into calibration cells to form an actual solder structure; a step for calculating a rework solder structure by subtracting the actual solder structure from the ideal solder structure; and a step for compensating for insufficient solder formed on the circuit board by discharging a proper amount of solder corresponding to the rework solder structure using a solder discharge device. Accordingly, insufficient solder can be easily and accurately compensated.