Chip mounting on over-chip adhesion or dielectric layer on substrate

摘要

An electronic module (100) comprising a first substrate (102), a first dielectric layer (104) on the first substrate (102), at least one electronic chip (106) having a first major surface (108) directly or indirectly on a portion the first dielectric layer (104) is mounted, a second substrate (110) over a second main surface (114) of the at least one electronic chip (106), and an electrical contact (116) for electrically contacting the at least one electronic chip (106) the first dielectric layer (104), wherein the first adhesion layer (104) extends over the first substrate (102) across an area exceeding the first major surface (108).