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Special Articles: Recent Trends on MCM and Bare LSI Chip Mounting. Manufacturing Process of PWBs for the Substrate of MCM and Bare Chip Mounting. Build-up Structure Pinted Circuit Board.

机译：特殊文章：近期MCM和裸LSI芯片安装的趋势。用于MCM和裸芯片安装基板的PWB的制造过程。积聚结构呈胶质电路板。

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Yutaka TSUKADA;
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年度 1994
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专利

1. Packaging alternatives to large silicon chips: tiled silicon on MCM and PWB substrates [J] . George A.G., Krusius J.P. IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging . 1996,第4期

机译：大型硅芯片的替代包装：MCM和PWB基板上的平铺硅片
2. Process Feasibility and Reliability Performance of Fine Pitch Si Bare Chip Embedded in Through Cavity of Substrate Core [J] . Han Younggun, Horiuchi Osamu, Hayashi Shigehiro, Components, Packaging and Manufacturing Technology, IEEE Transactions on . 2015,第4期

机译：通过基板芯腔嵌入细间距硅裸芯片的工艺可行性和可靠性能
3. Experimental investigation of new manufacturing process chains to create micro-metal structures on polymer substrates for lab-on-chip sensors [J] . Matteo Calaon, Aminul Islam, Hans N. Hansen, The International Journal of Advanced Manufacturing Technology . 2012,第1a4期

机译：新制造工艺链的实验研究，以在芯片实验室传感器的聚合物基板上创建微金属结构
4. Bare chip stacking structure for MCM production [C] . Kimura, T., Okuda, . 1998

机译：用于MCM生产的裸芯片堆叠结构
5. Special Articles: Recent Trends on MCM and Bare LSI Chip Mounting. Manufacturing Process of PWBs for the Substrate of MCM and Bare Chip Mounting. Full-Additive Process. [O] . Ryo ENOMOTO, Katsumi SAGISAKA 1994

机译：特殊文章：近期MCM和裸LSI芯片安装的趋势。用于MCM和裸芯片安装基板的PWB的制造过程。全添加过程。

Special Articles: Recent Trends on MCM and Bare LSI Chip Mounting. Manufacturing Process of PWBs for the Substrate of MCM and Bare Chip Mounting. Build-up Structure Pinted Circuit Board.

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