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Ag ALLOY SPUTTERING TARGET, PRODUCTION METHOD OF Ag ALLOY SPUTTERING TARGET, Ag ALLOY FILM AND PRODUCTION METHOD OF Ag ALLOY FILM

机译:Ag合金溅射靶材,Ag合金溅射靶材的制造方法,Ag合金膜及Ag合金膜的制造方法

摘要

PROBLEM TO BE SOLVED: To provide an Ag alloy sputtering target capable of depositing an Ag alloy film excellent in an electric characteristic, an optical characteristic and environmental resistance; and to provide a production method of the Ag alloy sputtering target, an Ag alloy film and a production method of the Ag alloy film.SOLUTION: An Ag alloy sputtering target has a composition containing Sn in the range of 0.1 atom% or more and 3.0 atom% or less, and Cu in the range of 1.0 atom% or more and 10.0 atom% or less, and having a residue comprising Ag and inevitable impurities.SELECTED DRAWING: None
机译:解决的问题:提供一种能够沉积电特性,光学特性和耐环境性优异的Ag合金膜的Ag合金溅射靶;并且提供了一种Ag合金溅射靶的制造方法,一种Ag合金膜以及该Ag合金膜的制造方法。解决方案:一种Ag合金溅射靶的组成中所含的Sn在0.1原子%以上且3.0以下原子%以下,且Cu在1.0原子%以上且10.0原子%以下的范围内,并且具有包含Ag和不可避免的杂质的残基。

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