Ag Ag Ag Ag Ag ALLOY SPUTTERING TARGET MANUFACTURING METHOD FOR Ag ALLOY SPUTTERING TARGET Ag ALLOY FILM AND MANUFACTURING METHOD FOR ALLOY FILM

摘要

The Ag alloy sputtering target of the present invention has a composition containing Sn at not less than 0.1 at% and not more than 3.0 at%, Cu at not less than 1.0 at% and not more than 10.0 at%, and the balance of Ag and inevitable impurities. In addition, the Ag alloy film of the present invention has a composition containing Sn at not less than 0.1 at% and not more than 3.0 at%, Cu at not less than 1.0 at% and not more than 10.0 at%, and the balance of Ag and inevitable impurities.