Apparatus and method for real-time three-dimensional sem imaging and viewing of a semiconductor wafer

摘要

One execution configuration is related to the manner of real time three dimensional electron beam image converting the substrate surface. By the fact that the primary electron beam is scanned on the substrate surface, radiation it can point to the electron from the substrate surface. Detecting these radiation electrons simultaneously multiple making use of the sensor outside two axes at least, it generates the multiple graphics data frames. Each graphics data frame originates in the electron which radiation is done with the view angle which differs from the substrate surface. By the fact that the multiple graphics data frames are treated automatically, three dimensional rendering of the substrate surface is generated. After that, multiple views of three dimensional rendering are displayed. Other execution configuration, also the aspect and feature are disclosed. Choice figure Drawing 1