Metallized resin film having a copper electroplating method and a copper plating film which is formed using the copper electroplating method

摘要

PROBLEM TO BE SOLVED: To provide a copper electroplating method for forming a copper plating film showing improved processability to a fine pattern wiring, and a metallized resin film obtained by using the copper electroplating method for depositing the copper plating film.;SOLUTION: In the copper electroplating method for forming the copper plating film by applying electric current to a copper plating solution, copper plating is carried out while adjusting the current density of the electric current applied to the copper plating solution to ≤0.5 A/dm² until thickness of the copper plating film reaches 2.5 μm, wherein the copper plating solution contains 8-30 wt.ppm organic compound including sulfur atom as a constituent atom.;COPYRIGHT: (C)2013,JPO&INPIT