首页> 外国专利> FIN-SHAPED FIELD-EFFECT TRANSISTOR WITH A GERMANIUM EPITAXIAL CAP AND A METHOD FOR FABRICATING THE SAME

FIN-SHAPED FIELD-EFFECT TRANSISTOR WITH A GERMANIUM EPITAXIAL CAP AND A METHOD FOR FABRICATING THE SAME

机译:带锗表层的鳍形场效应晶体管及其制造方法

摘要

A FinFET includes a fin-shaped structure, a gate structure, an epitaxial layer, an interlayer dielectric layer, an opening, a germanium cap and a contact plug. The fin-shaped structure is disposed on the substrate. The gate structure covers a portion of the fin-shaped structure. The epitaxial layer is disposed on the fin-shaped structure adjacent to the gate structure. The interlayer dielectric layer covers the gate structure and the epitaxial layer. The opening is in the interlayer dielectric layer. The germanium cap fills the bottom of the opening and has a germanium concentration in excess of 50 atomic %. The contact plug is disposed on the germanium cap in the opening.
机译:FinFET包括鳍形结构,栅极结构,外延层,层间电介质层,开口,锗盖和接触塞。鳍状结构设置在基板上。栅极结构覆盖鳍状结构的一部分。外延层设置在与栅极结构相邻的鳍形结构上。层间电介质层覆盖栅极结构和外延层。开口在层间电介质层中。锗盖填充开口的底部,并且锗浓度超过50原子%。接触塞布置在开口中的锗盖上。

著录项

  • 公开/公告号US2016104673A1

    专利类型

  • 公开/公告日2016-04-14

    原文格式PDF

  • 申请/专利权人 UNITED MICROELECTRONICS CORP.;

    申请/专利号US201414510119

  • 发明设计人 YU-CHENG TUNG;

    申请日2014-10-09

  • 分类号H01L23/522;H01L29/66;H01L21/768;H01L29/78;H01L23/532;

  • 国家 US

  • 入库时间 2022-08-21 14:38:17

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